Hermetic / Encapsulated Modules
Hermetically sealed and encapsulated modules are designed for demanding environments: high humidity, corrosive atmospheres, vacuum systems, and applications requiring MIL-STD-883 hermetic package compliance. Gold-brazed ceramic package with Kovar leads. Used in defense electronics, space-qualified payloads, and medical implants.
TECB-2/2-1-(2.6-2.1-1.4)-93
Catalog RoHS
- Size
- 5.1×5.1 mm
- dTmax
- 93 °C
- Qmax
- 1.4 W
- Imax
- 2.1 A
Hermetically housed 2-stage cascaded TEC micromodule, 93.0°C ΔTmax at Th=25°C.
View Specs →TECB-2/2-4-(2.6-1.7-1.1)-94
Catalog RoHS
- Size
- 5.1×5.1 mm
- dTmax
- 94 °C
- Qmax
- 1.1 W
- Imax
- 1.7 A
Hermetically housed 2-stage cascaded TEC micromodule, 94.0°C ΔTmax at Th=25°C.
View Specs →TECB-2/2-7-(2.6-1.3-0.8)-94
Catalog RoHS
- Size
- 5.1×5.1 mm
- dTmax
- 94 °C
- Qmax
- 0.8 W
- Imax
- 1.3 A
Hermetically housed 2-stage cascaded TEC micromodule, 94.0°C ΔTmax at Th=25°C.
View Specs →